An investigation of hardness and adhesion of sputter-deposited aluminum on silicon by utilizing a continuous indentation test
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- W.R. LaFontaine
- et al.
- 2011
- Journal of Materials Research
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Stress evolution due to electromigration in confined metal lines
- M.A. Korhonen
- P. Borgesen
- et al.
- 1993
- Journal of Applied Physics