Development of conductive adhesive materials for via fill applications
- Sung K. Kang
- Stephen L. Buchwalter
- et al.
- 2001
- IEEE Transactions on Components and Packaging Technologies
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20 results for Stephen L. Buchwalter
Development of conductive adhesive materials for via fill applications
- Sung K. Kang
- Stephen L. Buchwalter
- et al.
- 2000
- Proceedings - Electronic Components and Technology Conference
Characterization of electroplated bismuth-tin alloys for electrically conducting materials
- S.K. Kang
- Stephen L. Buchwalter
- et al.
- 2000
- Journal of Electronic Materials
Reaction of polyaniline with NMP at elevated temperatures
- A. Afzali
- Stephen L. Buchwalter
- et al.
- 1997
- Polymer
Aggregation and interchain "self" doping in emeraldine base
- S.M. Long
- K.R. Brenneman
- et al.
- 1997
- Synthetic Metals
Modeling and simulation of polyaniline derivatives
- A. Rossi
- Marie Angelopoulos
- et al.
- 1996
- Journal of Engineering and Applied Science
Future packaging materials: Cost performance, and environmental issues
- J.M. Shaw
- Stephen L. Buchwalter
- et al.
- 1996
- American Chemical Society, Polymer Preprints, Division of Polymer Chemistry
Formulating a cycloaliphatic epoxy for microelectronic encapsulation: A DSC study on a model system
- Stephen L. Buchwalter
- 1996
- American Chemical Society, Polymer Preprints, Division of Polymer Chemistry
Cleavable epoxy resins: Design for disassembly of a thermoset
- Stephen L. Buchwalter
- Laura L. Kosbar
- 1996
- J Polym Sci Part A
Dopant-induced excimer laser ablation of Poly(tetrafluoroethylene)
- C.R. Davis
- F.D. Egitto
- et al.
- 1992
- Applied Physics B Photophysics and Laser Chemistry