Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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3 results for R.H. Lacombe

Adhesion test standardization for multichip module packages
- - D.Y. Shih
  - J. Kim
  - et al.
- 1995
- ECTC 1995
Comparison of finite element stress analysis results with peel strength at the copper-polyimide interface
- - R.H. Lacombe
  - L.P. Buchwalter
  - et al.
- 1993
- Journal of Adhesion Science and Technology
Adhesion of polyimide to fluorine-contaminated Si0₂ surface. Effect of aminopropyltriethoxysilane on the adhesion
- - L.P. Buchwalter
  - R.H. Lacombe
- 1991
- Journal of Adhesion Science and Technology