Publications

3 results for Sung K. Kang

Thermocompression bonding of aluminum bumps in TAB applications
- - Sung K. Kang
- 1998
- ECTC 1998
Gold-to-aluminum bonding for TAB applications
- - Sung K. Kang
- 1992
- ECTC 1992
Gold-to-Aluminum Bonding for TAB Applications
- - Sung K. Kang
- 1992
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology