Large Feature Wafer Level In-Line Optical Metrology Techniques for Advanced Packaging SchemesKatherine SiegChris Bottomset al.2024SPIE Advanced Lithography + Patterning 2024
From Lab to Fab - In-line SIMS for Process Control in Nanosheet Gate-All-Around Device ManufacturingStefan SchoecheKatherine Sieget al.2024SPIE Advanced Lithography + Patterning 2024
Spectral Interferometry for TSV Metrology in Chiplet TechnologyStefan SchoecheDaniel Schmidtet al.2024SPIE Advanced Lithography + Patterning 2024