Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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5 results for Oluwafemi Ogunsola

'Trimodal' wafer-level package: Fully compatible electrical, optical, and fluidic chip I/O interconnects
- - Muhannad S. Bakir
  - Bing Dang
  - et al.
- 2007
- ECTC 2007
CoWP metal caps for reliable 32 nm 1X Cu interconnects in porous ULK (k=2.4)
- - E. Huang
  - M. Oh
  - et al.
- 2009
- ADMETA 2009
UV curing-induced photoresist poisoning in advanced ULK BEOL integration schemes
- - Y.C. Ee
  - D. Kioussis
  - et al.
- 2009
- ADMETA 2009
Effect of TaN stoichiometry on barrier oxidation and defect density in 32nm Cu/ultra-low K interconnects
- - Andrew H. Simon
  - Frieder Baumann
  - et al.
- 2010
- MRS Online Proceedings Library
High performance 32nm SOI CMOS with high-k/metal gate and 0.149μm ² SRAM and ultra low-k back end with eleven levels of copper
- - B. Greene
  - Q. Liang
  - et al.
- 2009
- VLSI Technology 2009