Nanoporous materials integration into advanced microprocessors
- E. Todd Ryan
- Cathy Labelle
- et al.
- 2005
- MRS Spring Meeting 2005
Publications
Date
Featured collections
Popular topics
2 results for C. Taft
CoWP metal caps for reliable 32 nm 1X Cu interconnects in porous ULK (k=2.4)
- E. Huang
- M. Oh
- et al.
- 2009
- ADMETA 2009