Thermal cycle reliability of stacked via structures with copper metallization and an organic low-k dielectric
- R. Filippi
- J.F. McGrath
- et al.
- 2004
- IRPS 2004
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16 results for Vincent McGahay
Porous ILD process development for sub 100nm integration
- K. Malone
- S.T. Chen
- et al.
- 2003
- ADMETA 2003
High performance 0.13 μm SOI CMOS technology with Cu interconnects and low-k BEOL dielectric
- P. Smeys
- V. McGahay
- et al.
- 2000
- VLSI Technology 2000
Modular 0.13 μm bulk CMOS technology for high performance and low power applications
- L.K. Han
- S. Biesemans
- et al.
- 2000
- VLSI Technology 2000
A high performance 0.13 μm copper BEOL technology with low-k dielectric
- R.D. Goldblatt
- B.N. Agarwala
- et al.
- 2000
- IITC 2000
Integration of copper and fluorosilicate glass for 0.18 μm interconnections
- E. Barth
- T. Ivers
- et al.
- 2000
- IITC 2000