CFD analysis of molten solder flow behavior and bridging mechanism during solder bump formation
- Risa Miyazawa
- Keishi Okamoto
- et al.
- 2019
- InterPACK 2019
Publications
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52 results for Hiroyuki Mori
An earbud-type wearable (A hearable) with vital parameter sensors for early detection and prevention of heat-stroke
- Keiji Matsumoto
- Yuksel Temiz
- et al.
- 2019
- EMBC 2019
Effects of build-up material properties on warpage dispersion of organic substrates caused by manufacturing variations
- Keishi Okamoto
- Sayuri Kohara
- et al.
- 2017
- InterPACK 2017
The mechanism of the low-k stress reduction in chip assembly by shorter solder bump height
- Keiji Matsumoto
- Keishi Okamoto
- et al.
- 2017
- InterPACK 2017
Implementation challenges for scalable neuromorphic computing
- Shintaro Yamamichi
- Akihiro Horibe
- et al.
- 2017
- VLSI Circuits 2017
Implementation challenges for scalable neuromorphic computing
- Shintaro Yamamichi
- Akihiro Horibe
- et al.
- 2017
- VLSI Technology 2017
Flip chip joining with low temperature solders and thermal gradient bonding
- Toyohiro Aoki
- Eiji Nakamura
- et al.
- 2017
- ICEP 2017
Effects of solder wettability of resist materials on solder filling with Injection Molded Solder (IMS) technology
- Toyohiro Aoki
- Takashi Hisada
- et al.
- 2016
- ICEP 2016
Thermal performance evaluation of dual-side cooling for a three-dimensional (3D) chip stack: Additional cooling from the laminate (substrate) side
- Keiji Matsumoto
- Hiroyuki Mori
- et al.
- 2016
- ICEP 2016
Advanced interconnect technologies in the era of cognitive computing
- Yasumitsu Orii
- Akihiro Horibe
- et al.
- 2016
- Pan Pacific 2016