Implementation challenges for scalable neuromorphic computing
- Shintaro Yamamichi
- Akihiro Horibe
- et al.
- 2017
- VLSI Technology 2017
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54 results for Hiroyuki Mori
Flip chip joining with low temperature solders and thermal gradient bonding
- Toyohiro Aoki
- Eiji Nakamura
- et al.
- 2017
- ICEP 2017
Novel Low Cost Bumping Process with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS) for Fine Pitch Flip Chip Joining
- Toyohiro Aoki
- Takashi Hisada
- et al.
- 2016
- ECTC 2016
Solder Injected through Via for Multi Stacked Wafers
- Akihiro Horibe
- Kuniaki Sueoka
- et al.
- 2016
- ECTC 2016
Proposal of Package Structure Requirements for Effective Cooling from the Bottom Side of Chips (from the Substrate Side), Aiming for a Three-Dimensional (3D) Chip Stack
- Keiji Matsumoto
- Hiroyuki Mori
- 2016
- ECTC 2016
Full intermetallic joints for chip stacking by using thermal gradient bonding
- T.L. Yang
- Toyohiro Aoki
- et al.
- 2016
- Acta Materialia
Effects of solder wettability of resist materials on solder filling with Injection Molded Solder (IMS) technology
- Toyohiro Aoki
- Takashi Hisada
- et al.
- 2016
- ICEP 2016
Thermal performance evaluation of dual-side cooling for a three-dimensional (3D) chip stack: Additional cooling from the laminate (substrate) side
- Keiji Matsumoto
- Hiroyuki Mori
- et al.
- 2016
- ICEP 2016
Advanced interconnect technologies in the era of cognitive computing
- Yasumitsu Orii
- Akihiro Horibe
- et al.
- 2016
- Pan Pacific 2016
Development of liquid photoresist for IMS (Injection molded solder) with high thermal stability
- Jun Mukawa
- Seiichirou Takahashi
- et al.
- 2016
- J. Photopolym. Sci. Tech.