Electrical assessment of chip to chip connection for ultra high density organic interposer
- Keishi Okamoto
- Hiroyuki Mori
- et al.
- 2014
- ICEP 2014
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52 results for Hiroyuki Mori
Thermo-mechanical evaluation of 3D packages
- Sayuri Kohara
- Akihiro Horibe
- et al.
- 2013
- 3DIC 2013
Electrical capability assessment for high wiring density organic interposer
- Keishi Okamoto
- Hiroyuki Mori
- et al.
- 2013
- EDAPS 2013
Thermal design guideline and new cooling solution for a three-dimensional (3D) chip stack
- Keiji Matsumoto
- Soichiro Ibaraki
- et al.
- 2013
- 3DIC 2013
Electrical characterization of low-cost glass/epoxy laminates at millimeter wave frequencies
- Noam Kaminski
- Evgeny Shumakher
- et al.
- 2013
- EPEPS 2013
Scaling challenges of semiconductor packaging in the era of big data
- Yasumitsu Orii
- Akihiro Horibe
- et al.
- 2013
- IMAPS 2013
High thermal conductive inter chip fill for 3D-IC through pre-applied joining process
- Y. Kawase
- M. Ikemoto
- et al.
- 2013
- IMAPS 2013
Scaling challenges of packaging in the Era of Big Data
- Yasumitsu Orii
- Akihiro Horibe
- et al.
- 2013
- VLSI Technology 2013
Fully On-Chip MAC at 14 nm Enabled by Accurate Row-Wise Programming of PCM-Based Weights and Parallel Vector-Transport in Duration-Format
- Pritish Narayanan
- Stefano Ambrogio
- et al.
- 2021
- IEEE T-ED
Development of liquid photoresist for IMS (Injection molded solder) with high thermal stability
- Jun Mukawa
- Seiichirou Takahashi
- et al.
- 2016
- J. Photopolym. Sci. Tech.