Vacuum ultraviolet (VUV) surface treatment process for flip chip and 3-D interconnections
- K. Sakuma
- N. Nagai
- et al.
- 2009
- ECTC 2009
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Effects of vacuum ultraviolet surface treatment on the bonding interconnections for flip chip and 3-D integration
- Katsuyuki Sakuma
- Jun Mizuno
- et al.
- 2010
- IEEE Transactions on Electronics Packaging Manufacturing
Simplified 20-μm pitch vertical interconnection process for 3D chip stacking
- Katsuyuki Sakuma
- Noriyasu Nagai
- et al.
- 2009
- IEEJ Transactions on Electrical and Electronic Engineering