On the contribution of line-edge roughness to intralevel TDDB lifetime in low-k dielectrics
- J.R. Lloyd
- X.-H. Liu
- et al.
- 2009
- IRPS 2009
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5 results for A. Lisi
Porous low-k material etch for 32 nm and beyond
- Catherine Labelle
- John Arnold
- et al.
- 2008
- ADMETA 2008
Graded spin-on organic bottom antireflective coating for high NA lithography
- Dario L. Goldfarb
- Sean D. Burns
- et al.
- 2008
- SPIE Advanced Lithography 2008
A multilevel copper/low-k/airgap BEOL technology
- S.V. Nitta
- S. Ponoth
- et al.
- 2007
- ADMETA 2007
Graded spin-on organic bottom antireflective coating for high na immersion lithography
- Dario L. Goldfarb
- Libor Vyklicky
- et al.
- 2008
- J. Photopolym. Sci. Tech.