Thermo-Compression Bonding and Mass Reflow Assembly Processes of 3D Logic Die Stacks
- Pascale Gagnon
- Christian Bergeron
- et al.
- 2017
- ECTC 2017
Publications
59 results for Raphael P. Robertazzi
Thermal analysis of multi-layer functional 3D logic stacks
- Michael Scheuermann
- Shurong Tian
- et al.
- 2016
- 3DIC 2016
Low-current spin transfer torque MRAM
- Guohan Hu
- J. J. Nowak
- et al.
- 2017
- VLSI-TSA 2017
Low-current Spin Transfer Torque MRAM
- Guohan Hu
- J. J. Nowak
- et al.
- 2017
- VLSI-DAT 2017
Dependence of Voltage and Size on Write Error Rates in Spin-Transfer Torque Magnetic Random-Access Memory
- J. J. Nowak
- Raphael P. Robertazzi
- et al.
- 2016
- IEEE Magnetics Letters
Techniques for reverse engineering and functionality extraction of mixed-signal ICs for security applications
- Franco Stellari
- Chung Ching Lin
- et al.
- 2015
- ISTFA 2015
Low-current spin transfer torque MRAM
- D.C. Worledge
- A. Annunziata
- et al.
- 2015
- INTERMAG 2015
TSV/FET proximity study using dense addressable transistor arrays
- Raphael P. Robertazzi
- Kanak Agarwal
- et al.
- 2015
- IRPS 2015
Analyzing path delays for accelerated testing of logic chips
- Emily Ray
- Barry P. Linder
- et al.
- 2015
- IRPS 2015
STT-MRAM with double magnetic tunnel junctions
- Guohan Hu
- J.H. Lee
- et al.
- 2015
- IEDM 2015