Delamination mechanisms of thermal interface materials in organic packages during reflow and moisture soaking
- Jiantao Zheng
- Virendra Jadhav
- et al.
- 2009
- ECTC 2009
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Development of a 50mm dual flip chip plastic land grid array package for server applications
- Sylvain Ouimet
- Jon Casey
- et al.
- 2008
- ECTC 2008