A high performance 0.13 μm copper BEOL technology with low-k dielectric
- R.D. Goldblatt
- B.N. Agarwala
- et al.
- 2000
- IITC 2000
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4 results for B.E. Kastenmeier
Effects of pore morphology on the diffusive properties of a porous low- κ dielectric
- E. Joseph
- S.P. Sant
- et al.
- 2007
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Surface etching mechanism of silicon nitride in fluorine and nitric oxide containing plasmas
- B.E. Kastenmeier
- 2001
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Gas utilization in remote plasma cleaning and stripping applications
- B.E. Kastenmeier
- G.S. Oehrlein
- et al.
- 2000
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films