Adhesion test standardization for multichip module packages
- D.Y. Shih
- J. Kim
- et al.
- 1995
- ECTC 1995
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4 results for P. Buchwalter
An optimal liner for copper damascene interconnects
- D. Edelstein
- C. Uzoh
- et al.
- 2001
- ADMETA 2001
Fabrication challenges for next-generation devices: Microelectromechanical systems for radio-frequency wireless communications
- David Seeger
- Jennifer Lund
- et al.
- 2003
- Journal of Microlithography, Microfabrication and Microsystems
Fabrication challenges for next generation devices: MEMS for RF wireless communications
- David Seeger
- Jennifer Lund
- et al.
- 2002
- Proceedings of SPIE - The International Society for Optical Engineering