Development of a 50mm dual flip chip plastic land grid array package for server applications
- Sylvain Ouimet
- Jon Casey
- et al.
- 2008
- ECTC 2008
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3 results for J. Casey
A multilevel copper/low-k/airgap BEOL technology
- S.V. Nitta
- S. Ponoth
- et al.
- 2007
- ADMETA 2007
Chip-to-Package Interaction for a 90 nm Cu / PECVD Low-k technology
- W. Landers
- D. Edelstein
- et al.
- 2004
- IITC 2004