A novel low resistance gate fill for extreme gate length scaling at 20nm and beyond for gate-last high-k/metal gate CMOS technologyU. KwonK. Wonget al.2012VLSI Technology 2012
A 90nm dual damascene hybrid (organic / inorganic) low-k - Copper BEOL integration schemeT. DaltonA. Cowleyet al.2003ADMETA 2003