Full intermetallic joints for chip stacking by using thermal gradient bonding
- T.L. Yang
- Toyohiro Aoki
- et al.
- 2016
- Acta Materialia
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30 results for Keiji Matsumoto
Thermal performance evaluation of dual-side cooling for a three-dimensional (3D) chip stack: Additional cooling from the laminate (substrate) side
- Keiji Matsumoto
- Hiroyuki Mori
- et al.
- 2016
- ICEP 2016
Advanced interconnect technologies in the era of cognitive computing
- Yasumitsu Orii
- Akihiro Horibe
- et al.
- 2016
- Pan Pacific 2016
Dual-side cooling for a three-dimensional (3D) chip stack : Additional cooling from the laminate (substrate) side
- Keiji Matsumoto
- Hiroyuki Mori
- et al.
- 2015
- ECTC 2015
Embedded power insert enabling dual-side cooling of microprocessors
- Thomas Brunschwiler
- Dominic Gschwend
- et al.
- 2015
- ECTC 2015
Cooling from the bottom side (laminate (substrate) side) of a three-dimensional (3D) chip stack
- Keiji Matsumoto
- Hiroyuki Mori
- et al.
- 2014
- 3DIC 2014
Pre-applied inter chip fill for 3D-IC joining
- Yasuhiro Kawase
- Makoto Ikemoto
- et al.
- 2014
- IMAPS 2014
High thermal conductivity underfill for the thermal management of three-dimensional (3D) chip stacks
- Keiji Matsumoto
- Hiroyuki Mori
- et al.
- 2014
- SEMI-THERM 2014
Laminate with thermal - Power insert for efficient front-side heat removal and power delivery
- Dominic Gschwend
- Timo Tick
- et al.
- 2014
- CIPS 2014
Thermo-mechanical evaluation of 3D packages
- Sayuri Kohara
- Akihiro Horibe
- et al.
- 2013
- 3DIC 2013