A 2.5D integrated voltage regulator using coupled-magnetic-core inductors on silicon interposer
- Noah Sturcken
- Eugene J. O'Sullivan
- et al.
- 2013
- IEEE JSSC
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44 results for Bucknell Webb
A study of current density limits due to saturation in thin film magnetic inductors for on-chip power conversion
- Philipp Herget
- Naigang Wang
- et al.
- 2012
- IEEE Transactions on Magnetics
Developments in integrated on-chip inductors with magnetic yokes
- Eugene J. O'Sullivan
- Naigang Wang
- et al.
- 2012
- PRiME/ECS Meeting 2012
Multiple voltage-supplies in TSV-based three-dimensional (3D) power distribution networks
- Zheng Xu
- Xiaoxiong Gu
- et al.
- 2012
- ECTC 2012
2.5D and 3D technology challenges and test vehicle demonstrations
- John Knickerbocker
- Paul Andry
- et al.
- 2012
- ECTC 2012
A 2.5D integrated voltage regulator using coupled-magnetic-core inductors on silicon interposer delivering 10.8A/mm 2
- Noah Sturcken
- Eugene O'Sullivan
- et al.
- 2012
- ISSCC 2012
Integrated on-chip inductors with electroplated magnetic yokes (invited)
- Naigang Wang
- Eugene J. O'Sullivan
- et al.
- 2012
- Journal of Applied Physics
Interconnect processes and reliability for RF technology
- Jeffrey P. Gambino
- F. Anderson
- et al.
- 2011
- IPFA 2011
Electromagnetic-SPICE modeling and analysis of 3D power network
- Zheng Xu
- Jian-Qiang Lu
- et al.
- 2011
- ECTC 2011
Stress characterization of tungsten-filled through silicon via arrays using very high resolution multi-wavelength raman spectroscopy
- Jeff Gambino
- Daniel Vanslette
- et al.
- 2011
- ECS Transactions