Publications

24 results for S. Choi

High reliability 32 nm Cu/ULK BEOL based on PVD CuMn seed, and its extendibility
- - Takeshi Nogami
  - Tibor Bolom
  - et al.
- 2010
- IEDM 2010
Effect of impurity on Cu electromigration
- - C.-K. Hu
  - Matthew Angyal
  - et al.
- 2010
- International Workshop STRESS-INDUCED PHENOMENA IN METALLIZATION 2010
CVD Co and its application to Cu damascene interconnections
- - Takeshi Nogami
  - J. Maniscalco
  - et al.
- 2010
- IITC 2010
Material and process for advanced Cu/ULK integration
- - Chih-Chao Yang
  - Daniel C. Edelstein
  - et al.
- 2008
- ADMETA 2008