Silicon layer stacking enabled by wafer bonding
- Chuan Seng Tan
- Kuan-Neng Chen
- et al.
- 2006
- MRS Fall Meeting 2006
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3 results for Andy Fan
Bonding parameters of blanket copper wafer bonding
- K.N. Chen
- A. Fan
- et al.
- 2006
- Journal of Electronic Materials
The effect of forming gas anneal on the oxygen content in bonded copper layer
- C.S. Tan
- K.N. Chen
- et al.
- 2005
- Journal of Electronic Materials