Functional Testing of AI Cores through Thinned 3D I/O Buffer Dies in 3D Die-Stacked Modules
- Mukta Farooq
- Arvind Kumar
- et al.
- 2022
- ECTC 2022
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9 results for Arvind Kumar
System Performance: From Enterprise to AI
- Arvind Kumar
- Leland Chang
- et al.
- 2018
- IEDM 2018
High performance 14nm SOI FinFET CMOS technology with 0.0174μm2 embedded DRAM and 15 levels of Cu metallization
- C.-H.C-H. Lin
- Brian Greene
- et al.
- 2014
- IEDM 2014
Lowerature wafer bonding for three-dimensional wafer-scale integration
- Zhe Wan
- Kevin Winstel
- et al.
- 2018
- S3S 2018
Machine intelligence through 3D waferscale integration
- Arvind Kumar
- Winfried W. Wilcke
- 2017
- S3S 2017
Nanotechnology requirements and challenges for large-scale brain computing
- Arvind Kumar
- 2016
- NANO 2016
Essential edge protection techniques for successful multi-wafer stacking
- Joshua Rubin
- Kevin Winstel
- et al.
- 2015
- S3S 2015
A novel ALD SiBCN low-k spacer for parasitic capacitance reduction in FinFETs
- Tenko Yamashita
- S. Mehta
- et al.
- 2015
- VLSI Technology 2015
Toward human-scale brain computing using 3D wafer scale integration
- Arvind Kumar
- Zhe Wan
- et al.
- 2017
- ACM JETC