Enabling SOI-based assembly technology for three-dimensional (3D) integrated circuits (ICs)
- A. Topol
- D.C. La Tulipe
- et al.
- 2005
- IEDM 2005
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4 results for Dominick Posillico
Critical aspects of layer transfer and alignment tolerances for 3D integration processes
- D.C. La Tulipe
- L.T. Shi
- et al.
- 2006
- GBC 2006
Assembly technology for three dimensional integrated circuits
- A. Topol
- D.C. La Tulipe
- et al.
- 2005
- VMIC 2005
Overlay as the key to drive wafer scale 3D integration
- Steven E. Steen
- Douglas LaTulipe
- et al.
- 2007
- Microelectronic Engineering