Measurement of microbump thermal resistance in 3D chip stacks
- E.G. Colgan
- Paul Andry
- et al.
- 2012
- SEMI-THERM 2012
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13 results for Joana Maria
Gender and collaboration patterns in a temporal scientific authorship network
- Gecia Bravo-Hermsdorff
- Valkyrie Felso
- et al.
- 2019
- Applied Network Science
3D chip-stacking technology with through-silicon vias and low-volume lead free interconnections
- Katsuyuki Sakuma
- Paul S. Andry
- et al.
- 2008
- IBM J. Res. Dev