Electromigration study in flip chip solder joints
- Jae-Woong Nah
- Kai Chen
- et al.
- 2007
- ECTC 2007
Publications
2 results for J.O. Suh
Electromigration in flip chip solder joints having a thick Cu column bump and a shallow solder interconnect
- Jae-Woong Nah
- J.O. Suh
- et al.
- 2006
- Journal of Applied Physics