Direct integration of dense parallel optical interconnects on a first level package for high-end servers
- Evan G. Colgan
- Bruce Furman
- et al.
- 2005
- ECTC 2005
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10 results for W.D. Dyckman
Efficient modeling methodology and hardware validation of glass-ceramic based wiring for high-performance single- And multi-chip modules
- Sungjun Chun
- Anand Haridass
- et al.
- 2005
- ECTC 2005
Determination of transmission line parameters in time- and frequency domain for product related packaging structures
- Thomas-Michael Winkel
- A. Deutsch
- et al.
- 2007
- IEEE-SPI 2007
Novel packaging of parallel-optical interconnects for high-end servers
- Steven A. Rosenau
- Jonathan Simon
- et al.
- 2006
- OFC 2006
Superior electrical properties of High Performance Glass Ceramic packaging for demanding SiGe, ASIC, microprocessor and advanced server applications
- Warren D. Dyckman
- Benjamin Fasano
- et al.
- 2005
- DPC 2005
Novel packaging of parallel-optical interconnects for high-end servers
- Steven A. Rosenau
- Jonathan Simon
- et al.
- 2005
- OFC/NFOEC 2005
Comparison of time- and frequency domain measurement results for product related card and MCM transmission lines up to 65 GHz
- Thomas-Michael Winkel
- A. Deutsch
- et al.
- 2005
- IEEE Topical Meeting EPEPS 2005
Novel packaging of parallel-optical interconnects for high-end servers
- Steven A. Rosenau
- Jonathan Simon
- et al.
- 2005
- OFC 2005
Low-Cost ceramic BGA package for 50 Gb/s multiplexing circuit
- Lei Shan
- Jean Trewhella
- et al.
- 2003
- IEEE Topical Meeting EPEPS 2003
40Gb/s Demonstration of IBM Standard Alumina BGA Packages
- Warren D. Dyckman
- Edward R. Pillai
- et al.
- 2003
- IEMT 2003