Efficient modeling methodology and hardware validation of glass-ceramic based wiring for high-performance single- And multi-chip modules
- Sungjun Chun
- Anand Haridass
- et al.
- 2005
- ECTC 2005
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6 results for Daniel O'Connor
Novel packaging of parallel-optical interconnects for high-end servers
- Steven A. Rosenau
- Jonathan Simon
- et al.
- 2006
- OFC 2006
Novel packaging of parallel-optical interconnects for high-end servers
- Steven A. Rosenau
- Jonathan Simon
- et al.
- 2005
- OFC/NFOEC 2005
Novel packaging of parallel-optical interconnects for high-end servers
- Steven A. Rosenau
- Jonathan Simon
- et al.
- 2005
- OFC 2005
Low-Cost ceramic BGA package for 50 Gb/s multiplexing circuit
- Lei Shan
- Jean Trewhella
- et al.
- 2003
- IEEE Topical Meeting EPEPS 2003
40Gb/s Demonstration of IBM Standard Alumina BGA Packages
- Warren D. Dyckman
- Edward R. Pillai
- et al.
- 2003
- IEMT 2003