Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying additionSung K. KangDonovan Leonardet al.2006Journal of Electronic Materials
The oxidation of lead-free Sn alloys by electrochemical reduction analysisSungil ChoJin Yuet al.2005JOM
Oxidation study of pure tin and its alloys via electrochemical reduction analysisSungil ChoJin Yuet al.2004Symposium on “Challenges in Advanced Thin Films: Microstructures, Interfaces, and Reactions" 2004
Controlling Ag3Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloyingSung K. KangDa-Yuan Shihet al.2004JOM