Use of difunctional silylation agents for enhanced repair of post plasma damaged porous low k dielectricsS.V. NittaS. Purushothamanet al.2005AMC 2005
Analysis of an extreme low-κ organosilicate dielectric film exposed to representative plasmas and to a restorative processM. ColburnS.V. Nittaet al.2003AMC 2003