Electrical validation of the integration of 193i and DSA for sub-20nm metal cut patterning
- Chi Chun Liu
- Richard Farrell
- et al.
- 2019
- MEMS/NEMS/MOEMS 2019
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9 results for Richard Farrell
Self-aligned blocking integration demonstration for critical sub-30nm pitch Mx level patterning with EUV self-aligned double patterning
- Angelique Raley
- Joe Lee
- et al.
- 2018
- SPIE Advanced Lithography 2018
DSA patterning options for logics and memory applications
- Chi Chun Liu
- Elliott Franke
- et al.
- 2017
- SPIE Advanced Lithography 2017
Electrical study of DSA shrink process and CD rectification effect at sub-60nm using EUV test vehicle
- Cheng Chi
- Chi Chun Liu
- et al.
- 2017
- SPIE Advanced Lithography 2017
Ultrathin EUV patterning stack using polymer brush as an adhesion promotion layer
- Indira Seshadri
- Anuja De Silva
- et al.
- 2017
- SPIE Advanced Lithography 2017
DSA via hole shrink for advanced node applications
- Cheng Chi
- Chi Chun Liu
- et al.
- 2016
- SPIE Advanced Lithography 2016
DSA patterning options for FinFET formation at 7nm node
- Chi Chun Liu
- Elliott Franke
- et al.
- 2016
- SPIE Advanced Lithography 2016
Self-aligned blocking integration demonstration for critical sub-30-nm pitch Mx level patterning with EUV self-aligned double patterning
- Angelique Raley
- Joe Lee
- et al.
- 2019
- J. Micro/Nanolithogr. MEMS MOEMS
Ultrathin extreme ultraviolet patterning stack using polymer brush as an adhesion promotion layer
- Indira Seshadri
- Anuja De Silva
- et al.
- 2017
- J. Micro/Nanolithogr. MEMS MOEMS