High-speed electrical testing of multichip ceramic modules
- Dennis G. Manzer
- John P. Karidis
- et al.
- 2005
- IBM J. Res. Dev
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2 results for Christopher W. Cline
Latent defect screening for high-reliability glass-ceramic multichip module copper interconnects
- Edward J. Yarmchuk
- Christopher W. Cline
- et al.
- 2005
- IBM J. Res. Dev