The microstructure, thermal fatigue, and failure analysis of near-ternary eutectic Sn-Ag-Cu solder joints
- Sung K. Kang
- Paul Lauro
- et al.
- 2004
- Materials Transactions
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.