Relationship between copper concentration and stress during electromigration in an Al(0.25 at.% Cu) conductor line
- H.K. Kao
- G.S. Cargill III
- et al.
- 2003
- Journal of Applied Physics
Publications
5 results for H.K. Kao
Electromigration of copper in Al(0.25 at.% Cu) conductor lines
- H.K. Kao
- G.S. Cargill III
- et al.
- 2001
- Journal of Applied Physics
Concentration and stress evolution during electromigration in passivated Al(0.25 at.% Cu) conductor lines
- H.K. Kao
- G.S. Cargill
- et al.
- 2000
- Materials Research Society Symposium-Proceedings
X-ray microbeam studies of electromigration
- G.S. Cargill III
- A.C. Ho
- et al.
- 1999
- Materials Research Society Symposium - Proceedings
In-situ x-ray microbeam Cu fluorescence and strain measurements on Al(0.5 at.% Cu) conductor lines during electromigration
- H.K. Kao
- G.S. Cargill III
- et al.
- 1999
- Materials Research Society Symposium - Proceedings