Dual-side cooling for a three-dimensional (3D) chip stack : Additional cooling from the laminate (substrate) side
- Keiji Matsumoto
- Hiroyuki Mori
- et al.
- 2015
- ECTC 2015
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42 results for Yasumitsu Orii
Development and commercialization of solder bump fabrication technology with molten solder injection method
- Toyohiro Aoki
- Kazushige Toriyama
- et al.
- 2015
- J. Jpn. Inst. Electron. Packag.
Cooling from the bottom side (laminate (substrate) side) of a three-dimensional (3D) chip stack
- Keiji Matsumoto
- Hiroyuki Mori
- et al.
- 2014
- 3DIC 2014
IMS (injection molded solder) technology with liquid photoresist for ultra fine pitch bumping
- Toyohiro Aoki
- Kazushige Toriyama
- et al.
- 2014
- IMAPS 2014
Wafer-level non conductive films for exascale servers
- Akihiro Horibe
- Sayuri Kohara
- et al.
- 2014
- ECTC 2014
Wafer IMS (Injection molded solder) - A new fine pitch solder bumping technology on wafers with solder alloy composition flexibility
- Jae Woong Nah
- Jeffrey Gelorme
- et al.
- 2014
- ECTC 2014
High thermal conductivity underfill for the thermal management of three-dimensional (3D) chip stacks
- Keiji Matsumoto
- Hiroyuki Mori
- et al.
- 2014
- SEMI-THERM 2014
Electrical assessment of chip to chip connection for ultra high density organic interposer
- Keishi Okamoto
- Hiroyuki Mori
- et al.
- 2014
- ICEP 2014
Characterization of micro bump formed by Injection Molded Solder (IMS) technology
- Toyohiro Aoki
- Kazushige Toriyama
- et al.
- 2014
- ICEP 2014
Fine-pitch solder joining for high density interconnection
- Kuniaki Sueoka
- Sayuri Kohara
- et al.
- 2014
- ICEP 2014