Integration and reliability of CVD Ru Cap for Cu/Low-k development
- C.-C. Yang
- D. Edelstein
- et al.
- 2009
- IITC 2009
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56 results for Chih-Chao Yang
Physical, electrical, and reliability characterization of Ru for Cu interconnects
- C.-C. Yang
- T. Spooner
- et al.
- 2006
- IITC 2006
Lower resistance scaled metal contacts to silicide for advanced CMOS
- A. Topol
- C. Sheraw
- et al.
- 2006
- VLSI Technology 2006
Extendibility of PVD barrier/seed for BEOL Cu metallization
- C.-C. Yang
- D. Edelstein
- et al.
- 2005
- IITC 2005
Stress migration reliability of copper interconnect stacked via structures with adjacent copper plates in low k- dielectrics
- D. Nguyen
- Kaushik Chanda
- et al.
- 2005
- VMIC 2005
Electromigration in sub-micron Cu interconnects in low k dielectrics
- B.N. Agarwala
- D. Nguyen
- et al.
- 2005
- ECS Meeting 2005
Electrical and reliability evaluation of Cu/Low-k integration: Exploration of PVD barrier/seed and CVD SiC(N,H) cap depositions
- C.-C. Yang
- D. Edelstein
- et al.
- 2004
- ADMETA 2004
Reliability, yield, and performance of a 90 nm SOI/Cu/SiCOH technology
- D. Edelstein
- C.R. Davis
- et al.
- 2004
- IITC 2004
Chip-to-Package Interaction for a 90 nm Cu / PECVD Low-k technology
- W. Landers
- D. Edelstein
- et al.
- 2004
- IITC 2004
90 nm SiCOH technology in 300 mm manufacturing
- L. Clevenger
- M. Yoon
- et al.
- 2004
- ADMETA 2004