X-ray characterization of PEALD versus PVD tantalum nitride barrier deposition and the impact on via contact resistance
- Xunyuan Zhang
- Oscar Van der Straten
- et al.
- 2013
- ECS Transactions
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21 results for J. Maniscalco
Impact of direct plasma densification on resistivity and conformality of PEALD tantalum nitride
- O. Van Der Straten
- Xunyuan Zhang
- et al.
- 2012
- PRiME/ECS Meeting 2012
Novel Cu reflow seed process for Cu/low-k 64nm pitch dual damascene interconnects and beyond
- K. Motoyama
- Oscar Van der Straten
- et al.
- 2012
- IITC 2012
Effects of Al and Mn impurities on Cu electromigration
- C.-K. Hu
- J. Ohm
- et al.
- 2011
- ADMETA 2011
Effect of impurity on Cu electromigration
- C.-K. Hu
- Matthew Angyal
- et al.
- 2010
- International Workshop STRESS-INDUCED PHENOMENA IN METALLIZATION 2010
CVD Co and its application to Cu damascene interconnections
- Takeshi Nogami
- J. Maniscalco
- et al.
- 2010
- IITC 2010
Interactions of metal-organic PEALD TaN with ultra-low k dielectric materials
- O. Van Der Straten
- H. Shobha
- et al.
- 2010
- ECS Transactions
Robust and low cost copper contact application for low power device at 32 nm-node and beyond
- Atsunobu Isobayashi
- James J. Kelly
- et al.
- 2009
- IITC 2009
PEALD Ru liner conformality and Cu trench fill characteristics
- O. Van Der Straten
- J. Wynne
- et al.
- 2008
- ECS Meeting 2008
PVD Cu reflow seed process optimization for defect reduction in nanoscale Cu/Low-k dual damascene interconnects
- K. Motoyama
- O. Van Der Straten
- et al.
- 2013
- JES