Evaluation of the chemical-mechanical planarization (CMP) performance of silicon nitride and silicon carbide as hard mask materials for Cu-based interconnect technology
- Wei-Tsu Tseng
- Jia Lee
- et al.
- 2002
- MRS Spring Meeting 2002
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.