Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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35 results for Paul Lauro

Study of the undercooling of Pb-free, flip-chip solder bumps and in situ observation of solidification process
- - Sung K. Kang
  - M.G. Cho
  - et al.
- 2007
- Journal of Materials Research
Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications
- - Sung K. Kang
  - Paul A. Lauro
  - et al.
- 2005
- IBM J. Res. Dev
The microstructure of Sn in near-eutectic Sn-Ag-Cu alloy solder joints and its role in thermomechanical fatigue
- - Donald W. Henderson
  - James J. Woods
  - et al.
- 2004
- Journal of Materials Research
Interfacial reaction studies on lead (Pb)-free solder alloys
- - Sung K. Kang
  - D.Y. Shih
  - et al.
- 2002
- IEEE Transactions on Electronics Packaging Manufacturing
Interfacial reactions, microstructure and mechanical properties of Pb-free solder joints in PBGA laminates
- - S.K. Kang
  - W.K. Choi
  - et al.
- 2002
- Proceedings - Electronic Components and Technology Conference