Study of the undercooling of Pb-free, flip-chip solder bumps and in situ observation of solidification process
- Sung K. Kang
- M.G. Cho
- et al.
- 2007
- Journal of Materials Research
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35 results for Paul Lauro
Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications
- Sung K. Kang
- Paul A. Lauro
- et al.
- 2005
- IBM J. Res. Dev
The microstructure of Sn in near-eutectic Sn-Ag-Cu alloy solder joints and its role in thermomechanical fatigue
- Donald W. Henderson
- James J. Woods
- et al.
- 2004
- Journal of Materials Research
Interfacial reaction studies on lead (Pb)-free solder alloys
- Sung K. Kang
- D.Y. Shih
- et al.
- 2002
- IEEE Transactions on Electronics Packaging Manufacturing
Interfacial reactions, microstructure and mechanical properties of Pb-free solder joints in PBGA laminates
- S.K. Kang
- W.K. Choi
- et al.
- 2002
- Proceedings - Electronic Components and Technology Conference