Publications

2 results for M. Poliks

Development of conductive adhesive materials for via fill applications
- - Sung K. Kang
  - Stephen L. Buchwalter
  - et al.
- 2001
- IEEE Transactions on Components and Packaging Technologies
Development of conductive adhesive materials for via fill applications
- - Sung K. Kang
  - Stephen L. Buchwalter
  - et al.
- 2000
- Proceedings - Electronic Components and Technology Conference