Advanced bilayer low-k dielectric cap for reliable high performance Cu-low k interconnects
- Griselda Bonilla
- Lawrence A. Clevenger
- et al.
- 2008
- ADMETA 2008
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66 results for Hosadurga Shobha
The effect of material and process interactions on BEOL integration
- T. Spooner
- J.C. Arnold
- et al.
- 2009
- ECS Meeting 2009
Low-k spacers for advanced low power CMOS devices with reduced parasitic capacitances
- Elbert Huang
- Eric Joseph
- et al.
- 2008
- IEEE International SOI Conference 2008
Optimized interfacial strength for dense and porous SiCOH
- D.D. Restaino
- Steve Molis
- et al.
- 2007
- ADMETA 2007
65nm Cu integration and interconnect reliability in low stress K=2.75 SiCOH
- V. McGahay
- G. Bonilla
- et al.
- 2006
- IITC 2006
Reactive monolayers in directed additive manufacturing – area selective atomic layer deposition
- Rudy J. Wojtecki
- Anuja DeSilva
- et al.
- 2018
- J. Photopolym. Sci. Tech.
Annealing and impurity effects in co thin films for MOL Contact and BEOL metallization
- James Kelly
- Vimal Kamineni
- et al.
- 2018
- JES
Fifteen Nanometer Resolved Patterns in Selective Area Atomic Layer Deposition - Defectivity Reduction by Monolayer Design
- Rudy J. Wojtecki
- Magi Mettry
- et al.
- 2018
- ACS AMI
SFG analysis of the molecular structures at the surfaces and buried interfaces of PECVD ultralow-dielectric constant pSiCOH: Reactive ion etching and dielectric recovery
- John N. Myers
- Xiaoxian Zhang
- et al.
- 2017
- Applied Physics Letters
Advanced single precursor based pSiCOH k = 2.4 for ULSI interconnects
- Deepika Priyadarshini
- Son Van Nguyen
- et al.
- 2017
- JVSTB