SFG analysis of the molecular structures at the surfaces and buried interfaces of PECVD ultralow-dielectric constant pSiCOH
- Xiaoxian Zhang
- John N. Myers
- et al.
- 2016
- Journal of Applied Physics
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66 results for Hosadurga Shobha
Effective Cu surface pre-treatment for high-reliable 22 nm-node Cu dual damascene interconnects with high plasma resistant ultra low-k dielectric (k = 2.2)
- F. Ito
- H. Shobha
- et al.
- 2012
- Microelectronic Engineering
Competitive and cost effective copper/low-k interconnect (BEOL) for 28 nm CMOS technologies
- R. Augur
- C. Child
- et al.
- 2012
- Microelectronic Engineering
Synergistic combinations of dielectrics and metallization process technology to achieve 22 nm interconnect performance targets
- G.A. Antonelli
- G. Jiang
- et al.
- 2012
- Microelectronic Engineering
Integration of photo-patternable low-κ material into advanced Cu back-end-of-the-line
- Qinghuang Lin
- Alshakim Nelson
- et al.
- 2010
- Japanese Journal of Applied Physics
Synthesis of high refractive-index melt-stable aromatic polyphosphonates
- H. Shobha
- H. Johnson
- et al.
- 2001
- J Polym Sci Part A