Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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55 results for Takeshi Nogami

CVD and ALD Co(W) films using amidinato precursors as a single-layered barrier/liner for next-generation Cu-interconnects
- - Hideharu Shimizu
  - Yudai Suzuki
  - et al.
- 2013
- ECS J. Solid State Sci. Technol.
Electromigration in Cu(Al) and Cu(Mn) damascene lines
- - C.-K. Hu
  - J. Ohm
  - et al.
- 2012
- Journal of Applied Physics
Effective Cu surface pre-treatment for high-reliable 22 nm-node Cu dual damascene interconnects with high plasma resistant ultra low-k dielectric (k = 2.2)
- - F. Ito
  - H. Shobha
  - et al.
- 2012
- Microelectronic Engineering
Competitive and cost effective copper/low-k interconnect (BEOL) for 28 nm CMOS technologies
- - R. Augur
  - C. Child
  - et al.
- 2012
- Microelectronic Engineering
Electrolyte additive chemistry and feature size-dependent impurity incorporation for Cu interconnects
- - J. Kelly
  - Takeshi Nogami
  - et al.
- 2012
- JES