Publications

2 results for Y. Yao

Novel Advanced Low-k Dielectric for 2 nm and Beyond Cu and Post Cu Dual Damascene BEOL Interconnect Technologies
- - S. Nguyen
  - H. Huang
  - et al.
- 2025
- VLSI Technology and Circuits 2025
Novel low k Dielectric materials for nano device interconnect technology
- - Son Van Nguyen
  - Hosadurga Shobha
  - et al.
- 2020
- VLSI-TSA 2020