Tungsten and cobalt metallization: A material study for MOL local interconnects
- Vimal Kamineni
- Mark Raymond
- et al.
- 2016
- IITC/AMC 2016
Publications
23 results for B. Peethala
Copper-to-dielectric heterogeneous bonding for 3D integration
- Wei Lin
- Juntao Li
- et al.
- 2014
- LTB-3D 2014
TiN metal hard mask removal with selectivity to tungsten and TiN liner
- S. Lippy
- L. Chen
- et al.
- 2013
- ECS Transactions