Novel Advanced Low-k Dielectric for 2 nm and Beyond Cu and Post Cu Dual Damascene BEOL Interconnect Technologies
- S. Nguyen
- H. Huang
- et al.
- 2025
- VLSI Technology and Circuits 2025
Publications
6 results for Matthew Shoudy
Innovations Enabling the Continued Extendibility of Cu and Post-Cu Damascene BEOL Technologies
- D. Edelstein
- A. Jog
- et al.
- 2025
- IITC 2025
Evaluation of different metal preclean conditions for MOL for 2nm and beyond: Topic/category: AEPM : nt Processes and Materials
- Samuel Munnangi
- Andrew Simon
- et al.
- 2024
- ASMC 2024
Subtractive Ru Interconnect Enabled by Novel Patterning Solution for EUV Double Patterning and TopVia with Embedded Airgap Integration for Post Cu Interconnect Scaling
- C. J. Penny
- Koichi Motoyama
- et al.
- 2022
- IEDM 2022
In-situ preclean run path impact on selective cobalt cap deposition and electromigration
- Matthew Shoudy
- Hosadurga Shobha
- et al.
- 2020
- ASMC 2020
Extreme-low k porous pSiCOH dielectrics prepared by PECVD
- H. You
- Petra Mennell
- et al.
- 2018
- JVSTB