Patterned adhesive flip chip technology for assembly on polyimide flex substrates
- R. Wayne Johnson
- Dan Maslyk
- et al.
- 1997
- International Journal of Microcircuits and Electronic Packaging
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.