Novel Advanced Low-k Dielectric for 2 nm and Beyond Cu and Post Cu Dual Damascene BEOL Interconnect Technologies
- S. Nguyen
- H. Huang
- et al.
- 2025
- VLSI Technology and Circuits 2025
Publications
5 results for Mary Claire Silvestre
Innovations Enabling the Continued Extendibility of Cu and Post-Cu Damascene BEOL Technologies
- D. Edelstein
- A. Jog
- et al.
- 2025
- IITC 2025
SRAM and Mixed-Signal Logic With Noise Immunity in 3-nm Nano-Sheet Technology
- Rajiv V. Joshi
- J. Frougier
- et al.
- 2025
- IEEE Open Journal of the Solid State Circuits Society
A Unified TDDB Model for BEOL Dielectrics of Various Structures and Thick FEOL Dielectrics
- Kenji Okada
- Kei Date
- et al.
- 2024
- IEEE Transactions on Electron Devices
A Systematic Study on BEOL Defectivity Control for Future AI Application
- James H.-C. Chen
- Fee Li Lie
- et al.
- 2020
- ASMC 2020