Thin, high atomic weight refractory film deposition for diffusion barrier, adhesion layer, and seed layer applications
- S.M. Rossnagel
- C. Nichols
- et al.
- 1996
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
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Ionized physical vapor deposition of Cu for high aspect ratio damascene trench fill applications
- C. Nichols
- S.M. Rossnagel
- et al.
- 1996
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures