Reliable Chiplet integration on high density laminate (2.X D) for AI HardwareDivya TanejaJonathan Pouliot-Grenieret al.2024ECTC 2024
Scalable Advanced DBHi Chiplet Package Using Silicon Bridge With 30 µm-Pitch Solder JointsAkihiro HoribeTakahito Watanabeet al.2024ECTC 2024
Reliable Direct Bonded Heterogeneous Integration ( DBHI) for AI HardwareDivya TanejaKatherine Pilgeret al.2024DPC 2024